TECHNICAL

TECHNICAL

  • Various technical services

    * Test Items

    * Experimental Equipment

    * System Improvements

  • Production equipment

    The purpose of packaging is to protect the chip from environmental influences and provide an interface for connection with external circuits. With the evolution of semiconductor technology, advanced packaging technologies such as flip-chip, fan-out, and 2.5D/3D packaging are becoming increasingly important, and the requirements for equipment are also becoming more stringent.