With the evolution of semiconductor technology, advanced packaging technologies such as flip-chip, fan-out, and 2.5D/3D packaging are becoming increasingly important, placing higher demands on equipment.
The following are some of the main packaging production equipment:
Wafer Backgrinding Machine：Before the wafer is cut, the back side of the wafer is ground to achieve the required thickness, improve heat dissipation, and facilitate subsequent packaging processes.
Wafer Dicing Machine：The entire wafer that has completed the front-end manufacturing process is cut into individual dies. This type of equipment is generally divided into abrasive wheel dicing machines and laser dicing machines.
Die Bonder / Die Attach Machine：The diced die is then precisely bonded to the substrate or leadframe. This requires highly precise alignment and bonding techniques.
Wire Bonder：Electrical connections are established by connecting the electrodes on the die to corresponding contacts on the substrate or lead frame using wires, copper wires, or aluminum wires.
Molding Machine：The wafer is encapsulated using epoxy resin or other plastic materials to form a shell, which protects the wafer and provides physical support.
Solder Ball Attacher / Bumper：In packages such as BGA (Ball Grid Array) or CSP (Chip Scale Package), solder balls are implanted or bumps are created to serve as an interface for connecting the chip to the circuit board.
Reflow Oven：Used in the reflow process for solder balls or bumps, it melts and solidifies solder paste to form a solid electrical connection.
Inspection & Measurement Equipment：Used for quality checks at various packaging stages, such as visual inspection and dimensional measurement, to ensure that products meet specifications.
Warpage Correction Machine：In some advanced packaging processes, wafers or substrates may warp due to material properties or stress; this device is used to correct their flatness.
Chip Manufacturing Line
Chip Packaging
